lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto through hole lamp product data sheetLTL1BETBEFJALCP1 spec no.: ds20-2014-0214effective date: 06/30/2015revision: - bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
1 / 9 part no. : ltl1b etb e f j a lc p1 bns - od - fc002/a4 through hole lamp ltl1be tb e f j a lc p1 through hole lamp ltl1b etb e f j a lc p1 rev description by date p 0 01 preliminary s pecification (rdr - 20141369 - 01) javy huang 1 1 / 21 /2014 above data for pd and customer tracking only - new specification and u pload on opnc javy huang 12/08 /201 4
2 / 9 part no. : ltl1b etb e f j a lc p1 bns - od - fc002/a4 through hole lamp ltl1be tb e f j a lc p1 1. description through - hole leds are offered in a variety of packages such as 3mm, 4mm, 5mm, rectangular, and cylinder which are suitable for all applications requiring status indication. several intensity and viewing angle choices are available in each color for design flexibility. 1 . 1. features ? low power consumption & h igh efficiency ? lead free & rohs compliant ? t - 1 type package. ? blue and red chips with white diffuser lens ? pre - cutting lead - frame 1.2 . applicat ions ? communication ? computer ? consumer ? home appliance 2 . outline dimensions notes : 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25mm (.010") unless otherwise noted. 3. protruded resin under flange is 1.0mm (.04") max. 4. lead spacing is meas ured where the leads emerge from the package. 5. specifications are subject to change without notice.
3 / 9 part no. : ltl1b etb e f j a lc p1 bns - od - fc002/a4 through hole lamp ltl1be tb e f j a lc p1 3. absolute maximum ratings at ta = 25 c parameter blue red unit power dissipation 70 5 2 mw peak forward current (duty cycle Q 1/10, pulse width Q 10ms) 60 60 ma dc forward current 2 0 2 0 ma operating temperature range - 30c to + 85c storage temperature range - 40c to + 100c lead soldering temperature [2.0mm (.079") from body] 260c for 5 seconds max. 4. electrical / optical characteristics at ta=25 c para meter symbol color min. typ. max. unit test condition radiant intensity i v blue red 38 110 1 1 0 495 310 880 mcd if = 5 ma note 1, 4 viewing angle 21/2 blue red 45 deg note 2 (fig.6) peak emission wavelength p blue red 468 632 nm measurement @peak (fig.1) dominant wavelength d blue red 465 61 7 47 1 624 478 6 32 nm if = 5 ma note 3 spectral line half - width ? blue red 2 5 20 nm forw ard voltage vf blue red 2.5 1.4 2. 8 1. 9 3. 4 2.4 v if = 5 ma reverse current ir blue red 100 a vr = 5v note: 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie eye - response curve. 2. 1/2 is the off - axis angle at which the luminous intensity is half the axial luminous intensity. 3 . the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wavelength which defines the color of the device. 4 . iv guarantee mu st be included with 30 % testing tolerance. 5 . reverse voltage (vr) condition is applied for ir test only. the device is not designed for reverse operation.
4 / 9 part no. : ltl1b etb e f j a lc p1 bns - od - fc002/a4 through hole lamp ltl1be tb e f j a lc p1 5. typical electrical / optical characteristics curves (25 c ambient temperature unless otherwise noted) b lue b lue red
5 / 9 part no. : ltl1b etb e f j a lc p1 bns - od - fc002/a4 through hole lamp ltl1be tb e f j a lc p1 6 . packing spec. 1000, 500, 200 or 100 pcs per packing bag 25 packing bags per inner carton t otal 25 ,000 pcs per inner carton 8 inner cartons per outer carton t otal 20 0 ,000 pcs per outer carton in every shipping lot, only the last pack will be non - full packing
6 / 9 part no. : ltl1b etb e f j a lc p1 bns - od - fc002/a4 through hole lamp ltl1be tb e f j a lc p1 7 . bin table specification bin code luminous intensity ( blue ) unit : mcd @ 5 ma bin code luminous intensity (red) unit : mcd @ 5 ma min. max. min. max. bc 38 65 fg 110 180 de hj 65 1 10 hj 180 310 fg 110 180 kl 310 520 hj 180 310 mn 520 880 note: tolerance of each bin limit is 15 % bin code dominant wavelength ( blue ) unit : nm @ 5 ma bin code dominant wavelength (red) unit : nm @ 5 ma min. max. min. max. 1 465 478 2 617 632 note: tolerance of each bin limit is 1nm
7 / 9 part no. : ltl1b etb e f j a lc p1 bns - od - fc002/a4 through hole lamp ltl1be tb e f j a lc p1 8 . cautions 8 . 1. application this led lamp is good for application of indoor and outdoor sign, also ordinary electronic equipment. 8 . 2. storage the storage ambient for the leds should not exc eed 30c temperature or 70% relative humidity. it is recommended that leds out of their original packaging are used within three months. for extended storage out of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 8 . 3. cleaning use alcohol - based cleaning solvents such as isopropyl alcohol to clean the leds if necessary. 8 . 4. lead forming & assembly during lead forming, the leads should be bent at a point at least 3mm from the base of led lens. do not use the base of the lead frame as a fulcrum during forming. lead forming must be done before soldering, at normal temperature. during assembly on pcb, use minimum clinch force possible to avoid exces sive mechanical stress. 8 . 5. soldering when soldering, leave a minimum of 2 mm clearance from the base of the lens to t he soldering point. dipping the lens into the solder must be avoided. do not apply any external stress to the lead frame during sol der ing while the led is at high temperature. r ecommended soldering conditions : soldering iron wave soldering temperature soldering time position 350c max. 3 seconds max. (one time only) no closer than 2 mm from the base of the epoxy bulb pre - heat pre - heat time solder wave soldering time dipping position 100c max. 60 seconds max. 260c max. 5 seconds max. no lower than 2 mm from the base of the epoxy bulb note: excessive soldering temperature and/or time might result in d eformation of the led lens or catastrophic failure of the led. ir reflow is not suitable process for through hole type led lamp product. 8 . 6. drive method an led is a current - operated device. in order to ensure intensity uniformity on multiple leds connec ted in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as shown in circuit a below. circuit model ( a ) circuit model ( b ) (a) recommended circuit (b) the brightness of each led might appear different due to the differences in the i - v characteristics of those leds. led led
8 / 9 part no. : ltl1b etb e f j a lc p1 bns - od - fc002/a4 through hole lamp ltl1be tb e f j a lc p1 8 .7. esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: ? use a conductive wrist band or anti - electrostatic glove when handling these leds ? all devices, equipment, and machinery must be properly grounded ? work tables, storage racks, etc. shou ld be properly grounded ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of friction between leds during storage and handing suggested checking list : training and certification 8 .7. 1 . 1 . everyone working in a static - safe area is esd - certified? 8 .7.1. 2. training records kept and re - certification dates monitored? static - safe workstation & work areas 8 .7.2.1 . static - safe workstation or work - areas have esd signs? 8 .7. 2. 2. a ll surfaces and objects at all static - safe workstation and within 1 ft measure less than 100v? 8 .7.2. 3. all ionizer activated, positioned towards the units? 8 .7.2. 4. each work surface mats grounding is good? personnel grounding 8 .7.3.1 . every p erson (including visitors) handling esd sensitive (esds) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 8 .7.3.1 . if conductive footwear used, conductive flooring also present where operator stand or walk? 8 .7.3.2 . g arments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 8 .7.3.3 . every wrist strap or heel strap/conductive shoes checked daily and result recorded for all dls? 8 .7.3.4 . all wrist strap or heel strap checkers calibration up to date? note: *50v for blue led. device handling 8 .7.4. 1. every esds items identified by eia - 471 labels on item or packaging? 8 .7.4. 2. all esds items completely inside properly closed static - shielding containers when not at stati c - safe workstation? 8 .7.4. 3. no static charge generators (e.g. plastics) inside shielding containers with esds items? 8 .7.4. 4. all flexible conductive and dissipative package materials inspected before reuse or recycle? others 8 .7.5. 1. audit result reported to entity esd control coordinator? 8 .7.5. 2. corrective action from previous audits completed? 8 .7.5. 3. are audit records complete and on file?
9 / 9 part no. : ltl1b etb e f j a lc p1 bns - od - fc002/a4 through hole lamp ltl1be tb e f j a lc p1 9 . reliability test classification test item test condition sample size reference st andard endurance test operation life ta = u nder room t emperature if = per datasheet maximum drive current test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1026 (1995) mil - std - 883g:1005 (2006) high temperature high humidity storage ta = 6 0 c rh = 90 % test time= 24 0hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 202g:103b (2002) jeita ed - 4701:100 103 (2001) high temperature storage ta= 105 5 c test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1031 (1995) mil - std - 883g:1008 (2006) jeita e d - 4701:200 201 (2001) low temperature storage ta= - 55 5 c test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) jeita ed - 4701:200 202 (2001) environmental test temperature cycling 100 c 25 c - 40 c 25 c 30mins 5mins 30mins 5mins 3 0 cycles 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1051 (1995) mil - std - 883g:1010 (2006) jeita ed - 4701:100 105 (2001) jesd22 - a104c (2005) thermal shock 100 5 c - 30 c 5 c 15mins 15mins 3 0 cycles (<20 secs transfer ) 22 pcs (cl=90%; ltpd=10 %) mil - std - 750d:1056 (1995) mil - std - 883g:1011 (2006) mil - std - 202g:107g (2002) jesd22 - a106b (2004) solder resistance t.sol = 260 5 c dwell time= 101 seconds 3mm from the base of the epoxy bulb 11 pcs (cl=90%; ltpd=18.9%) mil - std - 750d:2031(1995) jeita ed - 4701: 300 302 (2001) solderability t. sol = 245 5 c dwell time= 5 0.5 seconds (lead free solder, coverage R 95% of the dipped surface) 11 pcs (cl=90%; ltpd=18.9%) mil - std - 750d:2026 (1995) mil - std - 883g:2003 (2006) mil - std - 202g:208h (2002) ipc/eia j - std - 002 (2004) soldering iron t. sol = 350 5 c dwell time= 3.5 0.5 seconds 11 pcs (cl=90%; ltpd=18.9%) mil - std - 202g:208h (2002) jeita ed - 4701:300 302 (2001) 1 0 . others the appearance and specifications of the product may be modified for improvement, without prior notice.
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